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Engineering Letters
Information for Authors Engineering Letters welcomes submissions of manuscripts concerning any branch of the engineering and the computer science and their applications in business, industry and other subjects. The subjects covered by the journal include artificial intelligence, bioinformatics, chemical engineering, computational statistics, database, data mining, electrical engineering, electronics, engineering mathematics, engineering physics, environmental engineering, financial engineering, hardware systems, imaging engineering, industrial engineering, information engineering, internet computing, mechanical engineering, networking, operations research, scientific computing, software engineering, telecommunications, and their applications. All submitted papers are to be peer-reviewed for ensuring their qualities. Submissions must be previously unpublished. For the initial submission for reviewing, the manuscripts should be in the required two-column format. Accepted manuscripts should use the following journal template. The submission should include the PDF version of the manuscript. The MS Word Template (in A4 size and the IEEE two-column format) can be downloaded here (the doc file and its pdf file). The style template for the LaTeX can be downloaded here (the zipped LaTex file). The style template for the LaTeX along with the BibTeX template can be downloaded here (the zipped LaTex BibTeX file). The old simple style template for the LaTeX can be downloaded here (the LaTex file and its pdf file). The copyright form is available for download here.
Article Processing Charge and Open Access Upon acceptance of a manuscript for publication, the author will not need to pay any article processing charge for manuscripts less than five pages. The author or his/her institution or company will be asked to pay a mandatory article processing charge of US$280 for manuscripts of five to twenty pages, while US$300 for manuscripts more than twenty pages.
Call for International Advisory Board Members and Reviewers for Our Journal’s Sponsored Conferences Engineering experts and computer scientists are welcome to join the sponsored conferences of Engineering Letters as the members of the international advisory board or as reviewers. Special issues of our journal will be arranged for our sponsored conferences. Interested persons can send us an email, along with their curriculum vitae (CV), to el@iaeng.org.
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Engineering Letters
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